Posts by Hunter Brankamp
“We need to be solvent wiping our aluminum before it’s coated/painted/sealed/insert adhesion-intensive process here.”
Technically, that’s correct…you should be.
But is that understanding enough?
What could happen in 10 minutes?
Well, if you work to improve a manufacturing operation, you know that means quite a bit…
Manufacturer’s who paint, print, bond, coat, or seal have been left in the dark when searching for answers to solving their adhesion problems but…
There’s a light at the end of the tunnel.
In our last blog post, we explained the most common mistake manufacturers still make when it comes to solving their adhesion problems in manufacturing.
To summarize this dilemma, we posed a question on our LinkedIn page that revisited one manufacturer’s struggle to solve peeling paint in their operation, but the main objective was to solve a common manufacturing problem, with a not-so-common solution…
Answer: If the manufacturers below had looked to the material surface itself to solve their adhesion problems, tens of thousands of dollars and hundreds of production hours could have been saved. But, how we do know that?
Water break testing. Dyne pens. Goniometer. No method at all.
The search for a reliable, repeatable, objective method (i.e. not based on opinion) for measuring surface readiness in manufacturing was a search all too common among our current customers, and these methods are the most commonly tried and (formerly) used among them.
Achieving great adhesion in manufacturing comes down to surface preparation (we call it “Clean to a Number”) and optimal surface prep is the difference between an average product…and an industry-leading one.
But getting there means having an objectively quantified understanding of the top 3 molecular layers of your material surface.
Did we just say “top 3 molecular layers?”
On May 21-24, BTG Labs heads back to Long Beach, CA but this time for the SAMPE 2018 Conference & Exhibition.
Recently in Long Beach for AeroDef, one of the aerospace and defense industries’ most widely recognized conferences, BTG Labs now contributes to this tradeshow that features “the latest technologies and research advancements in the industry.” Maybe you’ve heard of a little instrument called The Surface Analyst?
New industry buzzword?
Or a new generation of process and quality control?
“We didn’t even know we were having process problems.”
It’s an all-too-common phrase we hear from our customers, when they realize the level of understanding available to them now in their manufacturing operation.
Simply put, you can’t solve an adhesion problem that doesn’t exist, and we’re willing to bet that it does.
• How do manufacturers go about finding these hidden, but massively impactful, manufacturing problems that exist in adhesion-related processes?
Sure enough, it’s a process.
Incoming! What’s that sound?
That’s the sound of manufacturers not having a supplier specification created for incoming materials in their operation.
It’s like the old piece of wisdom: You can’t know where you’re going unless you know where you came from.
While we’re not exactly sure who said it, it applies exactly to what’s needed when it comes to covering your bases from an incoming materials standpoint.
When most of us think of gold, we think of watches, rings, necklaces and even teeth.
For electronics manufacturer’s, gold is one of the highest quality and most electrically conductive materials used in electrical component manufacturing.
In order to best perform its golden duty as a conductor of electricity, the thin wire must make intimate contact with the circuit board itself. Without this connection, failure is inevitable.
A recent customer and manufacturer of microelectronic components needed a way to guarantee that the bonds created between the gold wire they were using in their microprocessors was maximally bonded to the gold-plated palladium bond pad. Were they able to achieve this?